Hot melt adhesives having improved pot lives and processes for their preparation

ABSTRACT

Holt melt adhesive compositions having longer pot lives and comprising adhesive thermoplastic compositions having high cohesion and low flowability based on copolymers A) composed of ethylenically unsaturated monomers containing chelating metal compounds B) and, if desired, other conventional additives C), these hot melt adhesive compositions additionally containing an alkylphenolic resin or an arylphenolic resin in amounts of up to 20% by weight, relative to copolymer A), as crosslinking regulator in order to extend the pot life and to improve their processibility like a thermoplastic, and processes for preparing hot melt adhesive compositions by mixing the starting components.

PRIOR APPLICATION

This application is a division of U.S. patent application Ser. No.641,496 filed Jan. 15, 1991, now U.S. Pat. No. 5,120,789.

DESCRIPTION

The invention relates to hot melt adhesive compositions having a longerpot life and comprising adhesive thermoplastic compositions having highcohesion and low flowability based on copolymers of ethylenicallyunsaturated monomers containing chelating metal compounds and, ifdesired, extenders and other conventional additives, these hot meltadhesive compositions additionally containing a crosslinking preferablyan alkylphenolic resin or an arylphenolic resin, to extend the pot life,to increase the heat resistance and the crosslinking temperature andthus to improve the thermoplastic processibility, and furthermore toprocesses for preparing adhesive thermoplastic compositions according tothe invention by mixing the starting components.

In European Patent No. 46,941, thermoplastic compositions havingincreased cohesion and low flowability and their use, inter alia, as hotmelt adhesives and hot melt contact adhesives are disclosed. Theyessentially comprise (A) at least one copolymer composed of at least onealkyl ester of α,β-ethylenically unsaturated mono- and/or dicarboxylicacids, at least one amide unsubstituted on the nitrogen ofα,β-ethylenically unsaturated mono- and/or dicarboxylic acids and atleast one α,β-ethylenically unsaturated mono- and/or dicarboxylic acidand, if desired, at least one other α,β-ethylenically unsaturatedcopolymerizable monomeric compound, and contain (B) at least onesubstance acting as a crosslinking agent which is a metal compound of analkyl acetoacetate having 1 to 6 carbon atoms in the alkyl group or of adihydric alcohol having 2 to 6 carbon atoms, in which the metal atom isan element from group 2, 3 or 4 of the periodic table of the elements,and they contain, if desired, (C) further additives acting as extendersand other customary additives.

Since the crosslinking can lead to inhomogeneities and anisotropies theproperties when the pure metal compound is added, the crosslinking agent(B) is preferably added in a homogeneous mixture with a synthetic resincomposed of component (C), preferably a terpene-phenolic resin, whichhas good compatibility with the copolymer (A). The preparation of thethermoplastic compositions, which, inter alia, are suitable as hot meltadhesives, is carried out in such a manner that copolymer (A) is treatedwith the crosslinking component (B) and, if desired, further additives(C) in a heatable mixer, such as a kneader or extruder, at 100° to 150°C., in the course of which crosslinking of copolymer (A) takes place.The mixing process must be discontinued as soon as a noticeable increasein the cohesion of the mixture has taken place and no more substantialincrease can be observed, which, depending on the temperature used, issaid to be the case in general after 1 to 15 minutes.

However, as has been shown in the meantime, the mixing process describeddoes in general not lead to these average degrees of crosslinking, suchas are initially required and desired for the necessary increase incohesion, but very rapidly and in most cases spontaneously anovercrosslinking with gelling takes place, which no longer allowsfurther processing of the composition. Accordingly, for the practicaluse of the compositions, this process has the crucial disadvantage thatthe pot life, calculated from the beginning of the mixing process of thestarting components, is only about 5 to 15 minutes. After that, thecrosslinked compositions cannot be melted and are rubberlike without,however, losing their contact adhesive properties and their surfacetackiness. However, they are no longer processible like a thermoplastic,which can lead to substantial losses and to damage to the melting andapplication apparatuses.

The object of the present invention was therefore to provide adhesivethermoplastic compositions having high cohesion and low flowabilitywhich have a longer residence time in the melting unit and a longer potlife without showing troublesome overcrosslinking or gelling during theprocessing and the crosslinking of which can then be completed withoutdisadvantages in a suitable manner, for example by a heat treatment attemperatures above the application temperature, to the extent required.

Surprisingly, it has now been found that the object can be achieved byadding a crosslinking regulator having specific activity to the adhesivethermoplastic compositions mentioned which have increased cohesion andlow flowability. The preferred crosslinking regulators found werealkylphenolic resins or arylphenolic resins, in particular alkylphenolicresins. Alkylphenolic resins based on trifunctional and/or preferablybifunctional (C₁ -C₁₂)-alkylphenols, in particular (C₃ -C₈)-alkylphenolsare particularly preferred. Preferred arylphenolic resins are thosebased on polyfunctional p-phenylphenols.

The alkylphenolic resins or arylphenolic resins used according to theinvention are in particular conventional reaction products ofalkylphenols or arylphenols with aldehydes, preferably withformaldehyde. They are added to the thermoplastic compositionspreferably in their resol form, in which they are mixed in with thethermoplastic composition either separately or in a mixture with thecrosslinking component (B). Surprisingly, it has been found that inparticular alkylphenolic resins can inhibit the crosslinking reaction atprocessing temperatures of up to 120° C. in a particularly efficientmanner whereas at temperatures above 130° C. they surprisingly losetheir inhibitory effect, so that at temperatures above 130° C. therequired final crosslinking state of the adhesive thermoplasticcompositions and their conversion into unmeltable materials, afterprevious application, can be achieved without disadvantages and withoutloss in adhesive activity. Below 130° C., the hot melt adhesivecompositions according to the invention can, however, be kept availablein a form in which they are processible like a thermoplastic as a moltencomposition without troublesome overcrosslinking or gelling for at least4 hours. By virtue of the higher proportions of crosslinking regulator,longer pot lives can be achieved. However, it is also possible and canbe advantageous in some cases to incorporate effective proportions ofthe crosslinking regulator in the thermoplastic melt at intervals andthus to extend the pot life as desired, for example to more than oneday. If desired, the adhesive thermoplastic melt can also be cooled toroom and be melted again later with repeated addition of an effectiveamount of crosslinking regulator and be converted into an applicablethermoplastic state. In contrast to the crosslinking-regulating activityspecific for a certain temperature range of the crosslinking regulatorsaccording to the invention, the additives described, for example, inEuropean Patent 46,941 as additional components (C), in particular theterpenephenolic resins described there, show no crosslinking-regulatingactivity, so that the effect of the crosslinking regulators according tothe invention seems even more surprising.

Accordingly, the invention relates to adhesive thermoplasticcompositions having high cohesion, low flowability and a longer pot lifeand based on copolymers of ethylenically unsaturated monomers andchelating agents, comprising

A) 90 to 99.99% by weight, preferably 95 to 99.9% by weight, of at leastone copolymer composed of

a) 20 to 95% by weight, preferably 40 to 80% by weight, of at least one(C₁ -C₁₂)-alkyl ester of α,β-ethylenically unsaturated mono- and/ordicarboxylic acids,

b) 0.1 to 20% by weight, preferably 0.5 to 15% by weight, of at leastone amide unsubstituted on the nitrogen of α,β-ethylenically unsaturatedmono- and/or dicarboxylic acids,

c) 0 1 to 15% by weight, preferably 0.2 to 10% by weight, of at leastone α,β-ethylenically unsaturated mono- and/or dicarboxylic acid, and

d) 0 to 50% by weight, preferably 0 to 40, in particular 0.1 to 30, % byweight, of at least one other α,β-ethylenically unsaturatedcopolymerizable compound which is different from the monomers mentionedunder a) to c), and

B) 0.01 to 10% by weight, preferably 0.1 to 5% by weight, of at leastone substance having a crosslinking action and being a metal compound ofan alkyl acetoacetate having 1 to 6 carbon atoms in the alkyl group orof a dihydric alcohol having 2 to 6 carbon atoms in which the metal atomis an element from group 2, 3 or 4 of the periodic table of theelements, the amounts of A)+B) and a) to d) each having to add up to100% by weight, and if desired

C) further additives acting as extenders and other conventionaladditives, which adhesive thermoplastic compositions additionallycontain

D) an effective amount of a crosslinking regulator.

Alkylphenolic resins or arylphenolic resins, in particular alkylphenolicresins, are preferably used as crosslinking regulators. Alkylphenolicresins composed of trifunctional and/or preferably bifunctional C₁-C₁₂)-alkylphenols, in particular (C₃ -C₈)-alkylphenols, and aldehydesare particularly preferred. Preferred arylphenolic resins are those frompolyfunctional p-phenylphenols and aldehydes. Resins from the alkyl- andarylphenols mentioned and formaldehyde, in particular resins of theresol type, are particularly preferred.

For example, alkylphenol/formaldehyde resins of the resol type, such as,for example, the commercial product ®Alresen PA 103 (manufacturer:Hoechst AG), are particularly preferred.

The amount of crosslinking regulator D) used is, according to theinvention, preferably 2 to 20% by weight, in particular 5 to 15,particularly preferably 8 to 12, % by weight, relative to the amount ofcopolymer A), the upper limits of the abovementioned amounts used notbeing critical.

Crosslinking regulator D) can be incorporated in the thermoplasticcompositions by conventional methods. The preferred procedure consistsin first melting copolymer A) in a heatable mixer, for example akneader, preferably at a temperature of 90° to 130° C., in particular110° to 120° C., as a result of which it generally adopts a viscous,honey-like consistency. Crosslinking regulator D), which is preferablypresent in solid form, is then admixed to the melted copolymer A), inthe course of which it dissolves in the melt of copolymer A). ComponentsB) and if desired, C) are then admixed to the melt in the heated mixer,in the course of which these components at the melting temperaturementioned, which has to be maintained, preferably at 110° to 120° C.,and with thorough mixing are either dissolved or homogeneouslydispersed, resulting in the desired adhesive thermoplastic and furtherheat-curable crosslinkable composition having high cohesion and lowflowability in an applicable form which can be maintained in anapplicable state at temperatures of up to 120° C., preferably between110° and 120° C., for at least 4 hours or up to one day or longerwithout substantial increase in viscosity or overcrosslinking. After thethermoplastic has been applied, for example by drawing out to a filmwith a knife or other applicators, the thermoplastic composition can beconverted to the required unmeltable final crosslinking state byincreasing the temperature to more than 130° C., preferably to 130° to200° C., in particular to 150° to 180° C.

A further preferred variation of the invention is to incorporatecomponents B) and D) as a mixture in the thermoplastic hot melt adhesivecomposition, if desired in admixture with further constituents ofcomponent C), it being possible for these mixtures to constitutesolutions or disperse systems. Furthermore, in some cases, it can beparticularly advantageous to admix crosslinking regulator D) in portionsat intervals to the thermoplastic composition.

The melting and mixing of components A) to D) can be carried outbatchwise, for example in a kneader, or continuously, preferably in aheatable single-screw or twin-screw extruder equipped with suitable feedand mixing zones arranged in the desired order. It is preferred to useheatable twin-screw extruders. In some cases, it can be advantageous toprepare the applicable thermoplastic hot melt adhesive composition underan inert gas atmosphere, for example nitrogen, and keep it under theinert gas until it is applied, for example in order to preventdiscoloration.

Since component C) frequently constitutes or contains an extender forcomponent B), it may be advantageous in some cases first to mixcomponents B) and C) separately with one another and use the resultingmixture for preparing the thermoplastic hot melt adhesive composition.

Accordingly, the invention further relates to processes for thepreparation of adhesive thermoplastic compositions according to theinvention having high cohesion, low flowability and extended pot life bymixing components A)+D) and B) and, if desired, C) in heatable mixers,such as, for example, kneaders, single-screw extruders or twin-screwextruders, preferably at temperatures between 90° and 130° C., inparticular 110° to 120° C., either batchwise or continuously.

The invention furthermore relates to the application of thermoplastichot melt adhesive compositions according to the invention in notovercrosslinked and ungelled form at temperatures of 90° to 130° C.,preferably at 110° to 120° C., and subsequent conversion of the adhesivethermoplastic compositions into the required unmeltable finalcrosslinking state by heat treatment at temperatures above 130° C.,preferably 130° to 200° C., in particular at 150° to 180° C.

Components D) which are used preferably are alkylphenol/formaldehyderesins having alkylphenol groups comprising p-isobutylphenol,p-tert.-butylphenol, p-tert.-amylphenol, p-isooctylphenol and o- orp-cyclohexylphenol and p-phenylphenol/formaldehyde resins, all of thempreferably of the resol type. Butylphenol/formaldehyde resins in theresol form are particularly preferred.

Examples of suitable carboxylic acids for components a) to c) ofcopolymer A) are crotonic acid, itaconic acid, maleic acid and/orfumaric acid and carboxyl-containing monomers derived from styrene, butpreferably acrylic and/or mathacrylic acid.

Examples of alkyl radicals in the ester component a) are preferablymethyl, ethyl, propyl, butyl, hexyl, 2-ethylhexyl, decyl and dodecyl andisomers thereof.

Mono- and/or diamides of the acids mentioned and monoamides of themonoesters of the abovementioned unsaturated dicarboxylic acids having 1to 12 carbon atoms in the alkyl group, for example the abovementionedalkyl radicals, are used as amides b). It is particularly advantageousto use as component a) 2-ethylhexyl acrylate by itself or in a mixturewith butyl acrylate or a predominant proportion of more than 50% byweight of 2-ethylhexyl acrylate or its mixture with butyl acrylate in amixture with other esters. In the mixture of the two esters mentioned,the butyl acrylate content can be up to 70, preferably 10 to 50% byweight, relative to 100% by weight of the ester mixture. Butyl acrylateis understood to mean the n-, sec.-, tert.- or iso-butyl acrylate,n-butyl acrylate being preferred.

Examples of suitable compounds d) are preferably styrene,α-methylstyrene, the various vinyltoluenes, ethylene, vinyl acetateand/or vinyl chloride.

In a preferred embodiment of the adhesive thermoplastic compositionsaccording to the invention, copolymer A) used is a product synthesizedfrom a) 55 to 65% by weight of 2-ethylhexyl acrylate, 15 to 30% byweight of butyl acrylate and 3 to 15% by weight of methyl methacrylate,b) 2 to 10% by weight of acrylamide and c) 0.3 to 5% by weight ofacrylic acid, each relative to copolymer A).

Copolymers A) can be obtained by conventional preparation methods, suchas solution or bulk polymerization, block or graft polymerization, withthe use of polymerization initiators, if appropriate with the additionaluse of molecular weight regulators. The most favorable results can beobtained by carrying out the copolymerization in the presence ofsolvents and then separating off the solvents by distillation atelevated temperature, i.e. up to about 200° C., if appropriate underreduced pressure. Suitable polymerization initiators are preferablyperoxides, such as di-tert.-butyl peroxide, dicumyl peroxide, cumenehydroperoxide, tert.-butyl hydroperoxide, tert.-butyl perbenzoate,tert.-butyl peroctoate, dibenzoyl peroxide, methyl ethyl ketoneperoxide, each individually or in a mixture, or azoisobutyrodinitrile,in amounts of 0.1 to 3, preferably 0.3 to 1% by weight, relative to thesum of components a) to d). Examples of suitable solvents are aromatichydrocarbons, such as toluene and xylene, and mixtures thereof withsaturated hydrocarbons, such as cyclohexane or benzine fractions, and/oralcohols, for example the various butanols. Since some solvents, forexample aromatic hydrocarbons or alcohols, can have a chain-terminatingeffect, it is possible to effect the molecular weight and the viscosityof the copolymer and thus of the hot melt contact adhesives by selectingthe solvent mixture used.

In most cases, copolymers A) have a melt viscosity, measured at 180° C.,of 5000 to 100,000, preferably 10,000 to 50,000 mPa.s. They have highthermal stability and can therefore be kept in a melt at temperatures ofup to 200° C. and for a period of up to 72 hours without substantialchanges in viscosity, color or other properties.

The metal atom in the substances B) having a crosslinking effect ispreferably, for example, zinc, magnesium, boron or titanium, but inparticular aluminum. The amounts given of the metal compounds of 0.01 to10% by weight (calculated as a 100% pure substance) relate to the sum ofcomponents A)+B) (=100% by weight).

If appropriate, component C) is used in amounts of 1 to 500, preferably50 to 250 parts by weight, relative to 100 parts by weight of the sum ofcomponents A)+B), but smaller amounts can also be used.

Additives C) which can be used are, for example, natural resins, such asbalsam, root, tall, rosin and copal resins and modified resins derivedtherefrom. The modification can be carried out with polyhydric alcohols,for example glycerol, pentaerythritol and glycols by esterification orby reaction with ethylenically unsaturated mono- and/or dicarboxylicacids, for example the ones mentioned above. It is also possible to usecopolymers of esterified natural resins with styrene, the variousvinyltoluenes or acrylic or methacrylic acid. Terpene-phenolic resinsand rosin resins modified with phenolic resins are particularlyadvantageous.

Resins if used as component C) are in general preferably present in anamount of from 1 to 100, in particular 2 to 50 parts by weight, relativeto 100 parts by weight of the sum of components A)+B).

Furthermore, synthetic resins, such as hydrocarbon resins, for examplebased on dicyclopentadiene, coumarone, indene or C₄ - to C₅ - or C₉-distillation fractions obtained during the petrochemical processing ofcrude oil may be suitable as component C). Resins based on ketones, suchas acetone, methyl ethyl ketone and cyclohexanone obtained by reactionof these compounds with formaldehyde are also suitable.

Plasticizers, for example those based on phthalic, adipic, sebacic,acelaic and phosphoric esters in which the alcohol moiety contains 1 to13 carbon atoms may be suitable as further additives C). Moreover, thephosphoric esters can be esterified with phenol or cresol. It is alsopossible to use plasticizers which react with copolymer A) via amonofunctional reactive group, such as glycidyl ethers or long-chainmonoisocyanates, and extender oils, such as, for example, mineral oil.

Furthermore, waxes may be suitable as further additives C), such asmontan waxes or synthetic products based on olefins, for examplepolyethylene or polypropylene waxes, and lower-molecular-weightpolymerization products of isobutylene, butadiene, isoprene, styrene,vinyl alkyl ethers whose alkyl radical contains 1 to 8 carbon atoms,vinylcarboxylic esters in which the carboxylic acid radical contains 1to 12 carbon atoms, vinylcyclohexane or α-methylstyrene. If they arecompatible, thermoplastic rubbers, such as can be obtained, for example,by block copolymerization of styrene with butadiene or styrene withisoprene, are also suitable as mixing components.

Of the class of bituminous products, unprocessed, blown, oxidized orotherwise modified bitumina, such as can be obtained in crude oil orcoal recovery, may be suitable.

Fillers, for example inorganic products, such as barium sulfate, calciumcarbonate, calcium sulfate, magnesium silicate, calcium/magnesiumcarbonate, alumina, quartz powder, colloidal or highly disperse silicas,which can all be used by themselves or in mixtures, may also be suitableas additive C). Pigments can also be used, although they must have hightemperature resistance and should advantageously belong to the class ofinorganic products or highly stable organic compounds, such as, forexample, phthalocyanine dyes. Fiber materials having a reinforcingeffect can also be used as extenders, for example asbestos or glassfibers and also synthetic products, such as polyester or polyamidefibers.

The adhesive thermoplastic compositions according to the invention can,in particular due to their extended pot life and the resulting good andeasy handling, particularly advantageously be used, for example, as hotmelt adhesives and hot melt contact adhesives, coating adhesives,sealable coatings, other adhesive or barrier, films and webs,furthermore as protective layer on metals by direct application or byapplication in the form of films.

The invention is illustrated in more detail by the examples whichfollow. pbw denotes parts by weight and % denotes % by weight, unlessstated otherwise

EXAMPLE 1

The starting components described below which have the compositionsgiven are used for preparing adhesive thermoplastic compositions havinghigh cohesion and low flowability which can be converted intounmeltable, rubber-like and surface-active contact adhesive compositionsby a heat aftertreatment, with which pot life tests are then carriedout.

Component A

Solid copolymer powder prepared by solution copolymerization andcomprising the following comonomer units:

61% by weight of 2-ethylhexyl acrylate

23% by weight of butyl acrylate

9% by weight of methyl methacrylate

6% by weight of acrylamide

1% by weight of acrylic acid

The copolymer has a melt viscosity of 45,000 mPa.s at 180° C. and aglass-transition temperature (T_(G)) of -45° C.

Component B

Commercially available aluminum alcoholate, solid, coarse-grained(®Additol VXL 12, manufacturer: Hoechst AG).

Component C

Commercially available terpenephenolic resin, solid scale-like (®AlresenPT 214, manufacturer: Hoechst AG).

Component D

Commercially available alkylphenol/formaldehyde resin of the resol type,solid, scale-like (®Alresen PA 103, manufacturer: Hoechst AG).

COMPARATIVE EXAMPLE 1

The components from Example 1 mentioned below are placed in the orderand amount given at 120° C. in a heatable kneader, and converted into amelt at 120° C. with vigorous mixing in the following manner:

100 pbw of component A are first introduced and melted.

A mixture of 9 pbw of component C and 2 pbw of component B which wasmelted beforehand and then powdered is then added to this melt and mixedhomogeneously, in the course of which an adhesive thermoplasticcomposition having high cohesion and low flowability is obtained at 110°to 120° C. in an applicable form, which is kept at a temperature ofabout 120° C. with constant gentle mixing. Soon after the mixture ofcomponents C and B has been admixed, the viscosity of the mixtureincreases and it is already clearly higher 5 minutes later. About 15minutes later, the composition undergoes extensive gelling, obviously asa result of overcrosslinking, and becomes unmeltable and rubber-likewithout, however, losing the contact adhesive properties and the surfacetackiness, and it is no longer processible like a thermoplastic. Theovercrosslinking can be reinforced further by a subsequent heataftertreatment at 180° C. Due to its short pot life of at most 15minutes at 120° C., the thermoplastic composition can only be processedduring this very short period and becomes unusable after this time.

EXAMPLES 2 to 4

Comparative Example 1 is repeated, using in each case the followingmodifications according to the invention:

After the melting process, 2 pbw (=Example 2) or 8 pbw (=Example 3) or15 pbw (=Example 4) of component D from Example 1 (=alkylphenolic resin)are first added and incorporated in starting component A at the meltingtemperature of A, component D being dissolved in component A. ComponentsB and C, respectively, are then incorporated as described in ComparativeExample 1, and the resulting adhesive thermoplastic compositions havinghigh cohesion and low flowability in an applicable form are kept at atemperature of about 120° C. with constant gentle mixing. The times(hours) after which at about 120° C. the compositions are in each casestill theremoplastic and applicable (pot life *) are summarized inTable 1. After the times corresponding to the pot lives given, each ofthe compositions is applied to a stainless steel sheet in the form of a2 mm thick film by means of a knife and then heated at 170° C. for 30minutes. Table 1 indicates whether the desired or requiredovercrosslinking has been achieved after this 30-minute heating at 170°C. and the composition has in each case become unmeltable andrubber-like, while maintaining its contact adhesive properties and itssurface tackiness.

EXAMPLE 5

Example 4 is repeated, except that the 15 pbw of component D are notadded and incorporated all at once but in 3 portions at variousintervals, namely

a) 4 pbw of component D during the melting of component A,

b) 5 pbw of component D 5 hours after incorporating components B and C,and

c) 6 pbw of component D 10 hours after incorporating the 5 pbw ofcomponent D mentioned above under b).

Table 1 lists the time after which the adhesive hot melt compositionconstantly maintained at about 120° C. is still thermoplastic andapplicable (pot life*) and is applied, and whether after application asa film the subsequent heating of the film at 170° C. for 30 minutesachieves the desired overcrosslinking in each case.

EXAMPLE 6

Example 5 is repeated, except that in each case before the addition ofportions b) (5 pbw of component D) and c) (6 pbw of component D) themelt is cooled to room temperature and after 5 hours each time in akneader it is first melted again and brought to about 120° C. beforeportions b) and c) of component D, respectively, are added and admixed.The applicability of the melt resulting after addition of the respectiveportions a) to c) of component D and maintained at about 120° C. (potlife*) and its overcrosslinking state, after application and subsequentheating at 170° C. for 30 minutes have been completed, are also shown inTable 1.

                                      TABLE 1                                     __________________________________________________________________________                         Melt behavior of the                                                Processible like a                                                                      applied thermoplastic                                                                     Surface tack and contact                     Thermoplastic contact                                                                    thermoplastic after                                                                     contact adhesive melt                                                                     adhesive property of                         adhesive hot melt                                                                        pot life at 120° C.                                                              after 30 minutes of heat                                                                  contact adhesive having                      from Example                                                                             of        aftertreatment at 170° C.                                                          become unmeltable                            __________________________________________________________________________    2          4 hours:                                                                            yes unmeltable  on-specification                             3          9 hours:                                                                            yes unmeltable  on-specification                             4          17 hours:                                                                           yes unmeltable  on-specification                             5          17 hours:                                                                           yes unmeltable  on-specification                             6          17 hours:                                                                           yes unmeltable  on-specification                             Comparative                                                                              15 min.:                                                                            yes unmeltable  on-specification                             Example 1                                                                     Comparative                                                                              20 min.:                                                                            no                                                           Example 1  (product is                                                                   unmeltable)                                                        __________________________________________________________________________

What we claim is:
 1. A process for the preparation of an adhesivethermoplastic composition having high cohesion, low flowability and alonger pot life and based on copolymers of ethylenically unsaturatedmonomers and chelating agents comprisingA) 90 to 99.99% by weight of atleast one copolymer comprisinga) 20 to 95% by weight of at least onealkyl of 1 to 12 carbon atoms ester of α,β-ethylenically unsaturatedmono- and/or dicarboxylic acids, b) 0.1 to 20% by weight of at least oneamide unsubstituted on the nitrogen of α,β-ethylenically unsaturatedmono- and/or dicarboxylic acids, c) 0.1 to 15% by weight of at least oneα,β-ethylenically unsaturated mono- and/or dicarboxylic acid, and d) 0to 50% by weight of at least one other α,β-ethylenically unsaturatedcopolymerizable compound which is different from the monomers of a) toc), and B) 0.01 to 10% by weight of at least one substance having acrosslinking action and being a metal compound of an alkyl acetoacetateof 1 to 6 carbon atoms in the alkyl or of a dihydric alcohol of 2 to 6carbon atoms in which the metal atom is an element from group 2, 3 or 4of the periodic table of the elements, the amounts of A)+B) and a) to d)each adding up to 100% by weight and optionally C) further additivesacting as extenders and other conventional additives which adhesivethermoplastic compositions additionally contain D) an effective amountof an alkylphenolic resin or an arylphenolic resin as a crosslinkingregulator comprising melting copolymer A) in a heatable mixer,dissolving cross-linking regulator D) in the melted copolymer A), addingcross-linking component B) and optionally component C to the melt in theheated mixer and dissolving or homogeneously dispersing with thoroughmixing of the mixture to obtain the adhesive polymer compositionoptionally at temperatures of up to 120° C.
 2. The process of claim 1wherein crosslinking regulator D) and crosslinking component B) andoptionally components C) are first melted with one another and themelted product is mixed with copolymer melt A).
 3. The process of claim1 wherein crosslinking regulator D) is admixed in portions at intervalsto the thermoplastic composition.
 4. A method of using an adhesivethermoplastic composition having high cohesion, low flowability and alonger pot life and based on copolymers of ethylenically unsaturatedmonomers and chelating agents and comprisingA) 90 to 99.99% by weight ofat least one copolymer comprisinga) 20 to 95% by weight of at least onealkyl of 1 to 12 carbon atoms ester of α,β-ethylenically unsaturatedmono- and/or dicarboxylic acids, b) 0.1 to 20% by weight of at least oneamide unsubstituted on the nitrogen of α,β-ethylenically unsaturatedmono- and/or dicarboxylic acids, c) 0.1 to 15% by weight of at least oneα,β-ethylenically unsaturated mono- and/or dicarboxylic acid, and d) 0to 50% by weight of at least one other α,β-ethylenically unsaturatedcopolymerizable compound which is different from the monomers of a) toc), and B) 0.01 to 10% by weight of at least one substance having acrosslinking action and being a metal compound of an alkyl acetoacetateof 1 to 6 carbon atoms in the alkyl of or a dihydric alcohol of 2 to 6carbon atoms in which the metal atom is an element from group 2, 3 or 4of the periodic table of the elements, the amounts of A)+B) and a) to d)each adding up to C) 100% by weight and optionally further additivesacting as extenders and other conventional additives which adhesivethermoplastic compositions additionally contain an effective amount ofan alkylphenolic resin or an arylphenolic resin as a cross-linkingregulator as a hot melt adhesive comprising applying it at a temperaturebelow 130° C. to a substrate and then converting it by a heat aftertreatment at a temperature between 130° and 200° C. into unmeltable,adhesive product having contact adhesive properties.